| Title | Evaluation of Nondestructive Tensile Testing |
|---|---|
| Record ID | 49538 |
| Personal Name Creator |
Polcari, Sam; Bowe, Jeffrey J. |
| Corporate Creator | John A. Volpe National Transportation Systems Center (U.S.); United States. National Aeronautics and Space Administration |
| Publisher | John A. Volpe National Transportation Systems Center (U.S.) |
| Publication Date | 19710500 |
| Language | English |
| Abstract | This report presents the results of a series of experiments performed in the evaluation of nondestructive tensile testing of chip and wire bonds. Semiconductor devices were subjected to time-temperature excursions, static-load life testing and multiple pre-stressing loads to determine the feasibility of a nondestructive tensile testing approach. The report emphasizes the importance of the breaking angle in determining the ultimate tensile strength of a wire bond, a factor not generally recognized nor implemented in such determinations. |
| Rosap ID | dot:38191 |
| Rosap URL | https://rosap.ntl.bts.gov/view/dot/38191 |
| TRT Terms | Semiconductor devices; Nondestructive tests; Chip seals; Tension tests |
| General Subjects | Chip and wire bonding; Maintenance and preservation; Testing |
| Geographical Coverage |
United States |
| TRIS Online Accession No |
1698660 |
| Contract Number | NA08 |
| Report Number | DOT-TSC-NASA-71-10 |
| Resource type | Tech Report |
| URL | https://ntlrepository.blob.core.windows.net/lib/49000/49500/49538/DOT-TSC-NASA-71-10.pdf |
| Format | |
| Database | NTL Digital Repository |